New on the Market

KEmtec Lab Devices is now shipping three different depths of 'Ultraclean Aluminum DSC Pans'. The deep pan allows more sample for testing yarns, carpet fibers and thin film materials. The shallow pan is designed for pharmaceuticals and fine chemicals where small samples are commonly employed for dynamic DSC Purity studies etc. These pans and lids are offered at lower prices than those provided by major instrument companies. For more information call 706-290-2664 (E Mail CEar602@aol.com) or visit our web site www.KEmtecLabDev.com.

PerkinElmer, Inc. has launched a new version of its PyrisTM thermal analysis software used in materials and pharmaceutical labs. Pyris 7.0 adds important productivity-enhancing capabilities with its real-time reference curve and calculations features. With these new features, a user can compare a current measurement against a reference curve during data collection and have the software execute real-time calculations during sample runs, enabling quicker decisions. MultiCurve™, another new enhancement, allows users to save a view of several different data files in one single file for quick and easy reference. This can include similar instrument files or an overlay of multiple thermal analysis instrument curves (such as DSC, TGA, TG/DTA or TMA). Results can be saved and recalled at any time for review. Users can also generate reports and print while running multiple measurements.

Mettler Toledo is pleased to announce the launch of its new Thermal Analysis (TA) software, STARe, version 8.1. As a critical component of the total STARe TA solution, the new STARe software has been designed to support all Mettler Toledo TA hardware enhancements, including the new DSC sensor. This innovative software with Ethernet Capabilities has also been developed to deliver increased efficiency and automation through simple operations in an XP operating environment. The software brings an integrated database, supporting GLP/GMP requirements, numerous evaluation possibilities, and the ability for multi-user multi-tasking.

Anter Corporation has developed the QuickLineTM-50 Thermal Impedance Meter to address a pressing need in the electronic packaging industry to measure the thermal resistance of thermal interface materials, including phase change materials. This unique device (patent pending) accounts for the bulk material as well as its interface resistances, offering significant improvements over existing methods in speed, range, accuracy and ease of use. Instrument options are available to sut a range of temperatures (ambient, ambient to 100 C, ambient to 200 C), pressure loading (incrementally up to 200 psi) and material types (pads, films, sheets, gels, pastes). The easy to use WindowsTM-based software provides fully automated operation and reporting, including tests involving sequential temperature points.

Erich Robens